| bgapackage's Forum Info |
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| Additional Info About bgapackage |
| Location: |
Huizhou City, Guangdong，China |
| Bio: |
Electronic products of aerospace and navigation, motor vehicles, automobiles, outdoor LED lighting, solar energy and military enterprises with high reliability requirements, solder ball array devices (BGA/CSP/WLP/POP) and special devices on circuit boards are all facing microelectronics. The trend of miniaturization, and thin PCBs with a thickness of less than 1.0mm or flexible high-density assembly substrates, solder joints between devices and substrates become fragile under mechanical and thermal stress. |
| Sex: |
Undisclosed |
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