owtemperaturecuring (Newbie) Registration Date: 11-13-2022 Date of Birth: 05-05-1990 (34 years old) Local Time: 09-08-2024 at 12:20 AM Status: Offline

owtemperaturecuring's Forum Info Joined: 11-13-2022 Last Visit: 11-13-2022, 07:38 AM Total Posts: 0 (0 posts per day | 0 percent of total posts) (Find All Posts) Total Threads: 0 (0 threads per day | 0 percent of total threads) (Find All Threads) Time Spent Online: 56 Seconds Members Referred: 0 Reputation: 0 [Details] owtemperaturecuring's Contact Details Homepage: https://www.deepmaterialcn.com/low-temperature-curing-epoxy-adhesive-for-se

Additional Info About owtemperaturecuring Location: china Bio: This series is a one-component heat-curing epoxy resin for low temperature curing with good adhesion to a wide range of materials in a very short period of time. Typical applications include memory cards, CCD/CMOS program sets. Particularly suitable for thermosensitive components where low curing temperatures are required. Sex: Male