owtemperaturecuring's Forum Info |
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Additional Info About owtemperaturecuring |
Location: |
china |
Bio: |
This series is a one-component heat-curing epoxy resin for low temperature curing with good adhesion to a wide range of materials in a very short period of time. Typical applications include memory cards, CCD/CMOS program sets. Particularly suitable for thermosensitive components where low curing temperatures are required. |
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Male |
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