chipleveladhesive (Newbie) Registration Date: 11-27-2022 Date of Birth: 03-05-1995 (30 years old) Local Time: 11-03-2025 at 04:11 AM Status: Offline

chipleveladhesive's Forum Info Joined: 11-27-2022 Last Visit: 11-27-2022, 02:31 PM Total Posts: 0 (0 posts per day | 0 percent of total posts) (Find All Posts) Total Threads: 0 (0 threads per day | 0 percent of total threads) (Find All Threads) Time Spent Online: 4 Minutes, 56 Seconds Members Referred: 0 Reputation: 0 [Details] chipleveladhesive's Contact Details Homepage: https://www.deepmaterialcn.com/epoxy-underfill-chip-level-adhesives.html

Additional Info About chipleveladhesive Location: Huizhou City, Guangdong, China Bio: This product is a one component heat curing epoxy with good adhesion to a wide range of materials. A classic underfill adhesive with ultra-low viscosity suitable for most underfill applications. The reusable epoxy primer is designed for CSP and BGA applications. Sex: Male