| eucleveladhesives's Forum Info |
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| Additional Info About eucleveladhesives |
| Location: |
Huizhou City, Guangdong，China |
| Bio: |
This product is a one component heat curing epoxy with good adhesion to a wide range of materials. A classic underfill adhesive with ultra-low viscosity suitable for most underfill applications. The reusable epoxy primer is designed for CSP and BGA applications. https://www.epoxyadhesiveglue.com/product/epoxy-underfill-chip-level-adhesives/ |
| Sex: |
Male |
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