eucleveladhesives's Forum Info |
Joined: |
12-04-2022 |
Last Visit: |
12-04-2022, 01:43 PM |
Total Posts: |
0 (0 posts per day | 0 percent of total posts)
(Find All Posts)
|
Total Threads: |
0 (0 threads per day | 0 percent of total threads)
(Find All Threads)
|
Time Spent Online: |
3 Minutes, 17 Seconds |
Members Referred: |
0 |
Reputation: |
0
[Details] |
|
|
Additional Info About eucleveladhesives |
Location: |
Huizhou City, Guangdong,China |
Bio: |
This product is a one component heat curing epoxy with good adhesion to a wide range of materials. A classic underfill adhesive with ultra-low viscosity suitable for most underfill applications. The reusable epoxy primer is designed for CSP and BGA applications. https://www.epoxyadhesiveglue.com/product/epoxy-underfill-chip-level-adhesives/ |
Sex: |
Male |
|