eucleveladhesives
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Registration Date: 12-04-2022
Date of Birth: 03-04-1992 (33 years old)
Local Time: 06-11-2025 at 09:21 PM
Status: Offline

eucleveladhesives's Forum Info
Joined: 12-04-2022
Last Visit: 12-04-2022, 01:43 PM
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eucleveladhesives's Contact Details
Homepage: https://www.epoxyadhesiveglue.com/product/epoxy-underfill-chip-level-adhesi
  
Additional Info About eucleveladhesives
Location: Huizhou City, Guangdong,China
Bio: This product is a one component heat curing epoxy with good adhesion to a wide range of materials. A classic underfill adhesive with ultra-low viscosity suitable for most underfill applications. The reusable epoxy primer is designed for CSP and BGA applications. https://www.epoxyadhesiveglue.com/product/epoxy-underfill-chip-level-adhesives/
Sex: Male